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Semiconductor chip

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Hood Style Thermal Shock Chamber

Create Date:2020/7/7 16:50:22  Click:1979

Thermal Impact is widely used in the industries, such as: telecommunications, semiconductors,  chips, sensors, microelectronics, etc. Within the shortest time, Thermal Impact can test sample's chemical reactions and physic damage from the sudden and rapid changing of temperature, thus, it decreases the time for testing and verifying and improve the efficiency of developing new products and manufacturing.


Features:

* Super Rapid thermal Impact technique

*Self-RD  control system

*Super rapid freezing system

*Greatly improve the production efficiency

*Energy savings more than 30%

No-Frost test in long time low temperature

*executing in automatic on line product test


Model

TYST-600-60

TYST-600-65A

Dimensions

630*1230*890mm(W*H*D)

Temperature range

-60℃-+180°C

-65°C-+180°C

Rate of temperature change

-40°C +85°C ; +85°C--40°C/^10S

Standard deviation

±1.0°C

Display residual

≤0.1°C

Stability

≤0.5°C

Temperature overcharge control

1.0°C

Temperature control mode

Air temperature and sample temperature are interchangeable

Operation Method

Function and constant value (Maximun # of functions:30 sets)

Interface

LAN/RJ45  RS485/USB

Gas pressure

90Psi ~110Psi ( 20°C ~28°C )

Gas' rate of flow

700L/min ( 25SCFM )

Dew point temperature

10°C

Power supply

220VAC±10%,50HZ,25A (380VAC, 3P + N, 50HZ可选)

Weight

260KG


Related products

CONTACT US

Call us for more information
24-hour sales hotline:
18762942613
24-hour after-sales hotline:
18252992580
Suggestion and Complaint Tel:
0512-57354137
leave us a message
Online Message
AS of webchat QR code